An abstract submitted to Nature tells us about injectable hardware.
The abstract is below, but here are the salient points:
1: This is injected and then “unfolds” into a much larger structure.
“…interpenetration of electronics within artificial or natural structures could allow for continuous monitoring and manipulation of their properties”
OK we have control — I thought this was going to be harder for our machine masters. We are doing all the heavy lifting for them in advance.
“…electronic components can be injected into man-made and biological cavities”
Biological–OK got it
3:”…tight integration and low chronic immunoreactivity with several distinct regions of the brain, ”
4: “…in vivo multiplexed neural recording. ”
I think we have it now–
Injected into biologic entities for control and neural recording with tight integration with the brain..
We will truly be
Seamless and minimally invasive three-dimensional interpenetration of electronics within artificial or natural structures could allow for continuous monitoring and manipulation of their properties. Flexible electronics provide a means for conforming electronics to non-planar surfaces, yet targeted delivery of flexible electronics to internal regions remains difficult. Here, we overcome this challenge by demonstrating the syringe injection (and subsequent unfolding) of sub-micrometre-thick, centimetre-scale macroporous mesh electronics through needles with a diameter as small as 100 μm. Our results show that electronic components can be injected into man-made and biological cavities, as well as dense gels and tissue, with >90% device yield. We demonstrate several applications of syringe-injectable electronics as a general approach for interpenetrating flexible electronics with three-dimensional structures, including (1) monitoring internal mechanical strains in polymer cavities, (2) tight integration and low chronic immunoreactivity with several distinct regions of the brain, and (3) in vivo multiplexed neural recording. Moreover, syringe injection enables the delivery of flexible electronics through a rigid shell, the delivery of large-volume flexible electronics that can fill internal cavities, and co-injection of electronics with other materials into host structures, opening up unique applications for flexible electronics.